Simplinity Solutions Private Limited

A two-part soft thermally conductive silicone gap filler designed to dissipate heat and relieve stress between the battery modules and the cooling plate.

• Battery Pack Assembly

Benefits

• Thermal conductivity: > 3 W/m-K
• Room temperature or heat-accelerated cure
• Controlled siloxane volatility
• Non-flowable
• Long term performance stability during temperature and humidity cycling
• Holds vertical position (cured or uncured state)
• Low assembly forces

Gray, thixotropic, non-curing thermally conductive compound

Features & Benefits
 One part material – no cure required
 Solvent free formulation – provides material stability
 Easy application – Screen printable
 Thixotropic – low slump
 High thermal conductivity
 Achieves thin Bond Line Thickness (BLT)
 Low thermal resistance

Gray, flowable, non-curing thermally conductive compound.

Features & Benefits
• Solventless formulation
• Flowable
• Non-curing – no need for curing ovens
• Capable of achieving thin Bond Line Thickness for optimum performance
• Very low thermal resistance
• High thermal conductivity
• Conducts heat away from sensitive components 

White, non-curing and non-flowing thermally conductive compound.

Features & Benefits
 Non-flowing
 Moderate thermal conductivity
 No need for ovens or curing
 Heat flow away from circuitry components can increase reliability